Telecommunications chassis having mezzanine care interfaces

ABSTRACT

Embodiments are generally directed to a method and apparatus to couple a module to a management controller on an interconnect. In one embodiment, a method includes detecting that a module has coupled to an interconnect, the interconnect coupled to a modular platform backplane. The method further includes logically coupling the module to one of a plurality of management controllers resident on the interconnect, each management controller logically appears as a management controller for different interconnects coupled to the modular platform backplane.

RELATED APPLICATION

This application is a Continuation of U.S. application Ser. No.12/587,824, filed Oct. 14, 2009, which is a Continuation of U.S.application Ser. No. 10/027,142, filed Dec. 29, 2004. The entireteaching of the above applications is incorporated herein by reference.

TECHNICAL FIELD

Embodiments of the invention generally relate to the field of electronicsystems, and more particularly, to a method and apparatus to couple amodule to a management controller on an interconnect.

BACKGROUND

Modular systems are typically used in communication networks wherereliability and cost effectiveness are important factors. Modularsystems may include modular platforms. These modular platforms includebackplanes that receive and couple blades, boards, or interconnects.Blades, boards, or interconnects may further include modules to provideadditional functionality to the modular platform. Such additionalfunctionality may include providing mass storage, graphics processors orI/O processors.

Typically, modules provide this additional functionality in a costeffective manner. Accordingly, the ability to add as many modules aspossible to a given system and interconnect may be an objective whendesigning and operating a cost effective modular system. However, eachblade, board, or interconnect typically contains a single managementcontroller to support and/or control these modules. A single managementcontroller may limit the number of modules that can be supported and/orcontrolled on a typical blade, board, or interconnect. This limit to thenumber of modules supported and/or controlled may be problematic indesigning and operating a cost effective modular system.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention is illustrated by way of example, and not by way oflimitation, in the figures of the accompanying drawings in which likereference numerals refer to similar elements and in which:

FIG. 1 provides a partial view of an example modular platform, accordingto one embodiment;

FIG. 2 illustrates an example electronic system, according to oneembodiment;

FIG. 3 is an isometric view of an example interconnect, according to oneembodiment;

FIG. 4 is an architectural diagram of an example module manager,according to one embodiment;

FIG. 5 illustrates an example block diagram architecture for the logicalcoupling of modules to management controllers on an interconnect,according to one embodiment;

FIG. 6 provides a view of an example modular platform with slots toreceive and couple interconnects to a backplane, according to oneembodiment;

FIG. 7 is an isometric view of an example interconnect with interfacesto receive and couple modules in a horizontal manner, according to oneembodiment;

FIG. 8 provides a view of an example modular platform with aninterconnect received and coupled into three slots, according to oneembodiment; and

FIG. 9 is a flow chart of an example method to couple a module to amanagement controller on an interconnect, according to one embodiment.

DETAILED DESCRIPTION

Embodiments of the invention are generally directed to a method andapparatus to couple a module to a management controller on aninterconnect. A module manager is introduced herein. The module manageris operable to logically couple a module to one of a plurality ofmanagement controllers responsive to an interconnect. The module may bereceived and coupled to an interface on an interconnect and theinterconnect may be coupled to a modular platform backplane.

FIG. 1 provides a partial view of an example modular platform 100,according to one embodiment. Modular platform 100 may be a modularplatform server designed to be compliant with the PCI IndustrialComputer Manufacturers Group (PICMG), Advanced TelecommunicationsComputing Architecture (ATCA) Base Specification, PIGMG 3.0 Rev. 1.0,published Dec. 30, 2002 (hereinafter referred to as “the ATCAspecification”). FIG. 1 shows a partial view of modular platform 100having selected portions removed for clarity.

Modular platform 100 is depicted as including three interconnects 110,120 and 130, although the invention is not limited in this regard. Atleast a subset of the interconnects in modular platform 100 may containinput/output (I/O) connectors 108 which couple to a backplane 107. I/Oconnectors 108 may enable devices resident on a given interconnect tocommunicate with one or more elements of modular platform 100 or throughmodular platform 100 to devices resident on other interconnects. Atleast a subset of the interconnects may also contain a power connector109 to provide power to the interconnect from backplane 107.

In an example embodiment, interconnects 130 and 110 may be carrier cardsdesigned to couple one or more modules to one or more module interfaces(e.g., slots or carrier bays) resident on a given interconnect. Asdescribed in more detail below, interconnects that include one or moremodules may also include active circuitry to support and/or manage oneor more aspects of one or more modules coupled to the interconnect.

FIG. 2 illustrates an example electronic system, according to oneembodiment. The elements shown in electronic system 200 may represent ablock diagram architecture of active circuitry resident on interconnect110. This active circuitry may support and/or control one or moremodules received and coupled to interconnect 110. As shown, electronicsystem 200 is depicted as including one or more communication channel(s)202, interconnect control logic 204, interconnect memory 206,interconnect I/O interfaces 208, management controllers 210, moduleinterfaces 212, module manager 214 and interconnect applications 216.

In an example embodiment, communication channel(s) 202 may includecommunication links routed between elements of electronic system 200 andmay also include communication links routed through I/O connectors 108to a modular platform backplane.

In an example embodiment, interconnect memory 206 may storeinformation/features offered by electronic system 200. Interconnectmemory 206 may also be used to store temporary variables or otherintermediate information during execution of instructions byinterconnect control logic 204. Interconnect memory 206 may well includea wide variety of memory media including but not limited to volatilememory, non-volatile memory, flash, programmable variables or states,random access memory (RAM), read-only memory (ROM), flash, or otherstatic or dynamic storage media.

In an example embodiment, interconnect control logic 204 may invoke aninstance of interconnect applications 216 and/or management controllers210 to provide control and/or management for one or more modules thatmay be received and coupled to module interfaces 212. Control and/ormanagement may be provided through communication channel(s) 202 or acombination of communication channel(s) 202 and interconnect I/Ointerfaces 208. For example, communication channel(s) 202 may include aninterconnect management channel (e.g. a bus) to facilitate this controland/or management. Other elements of electronic system 200 may alsocommunicate in the same manner, although the invention is not limited inthis regard.

As described in more detail below, in an example embodiment,interconnect control logic 204 may invoke an instance of module manager214 to logically couple a module to one of a plurality of managementcontrollers 210.

FIG. 3 is an isometric view of an example interconnect 110, according toone embodiment. Interconnect 110 includes module interfaces 306A-H,circuit board 303, management controllers 304 and 305, I/O connectors108 and power connectors 109. In an example embodiment, interconnect 110may be a carrier card designed to receive and couple one or more modulesto one or more module interfaces resident on interconnect 110.

In the example embodiment shown in FIG. 3, modules 302A-G are depictedalready received and coupled to module interfaces 306A-G, while module302H is about to be coupled to module interface 306H. In an exampleembodiment, module 302H includes interface 310H. Interface 310H maycouple module 302H to module interface 306H. Although not shown in FIG.3, modules 302A-G also contain interfaces to couple each module to arespective module interface on interconnect 110.

In an example embodiment, module interfaces 212 of electronic system 200may include module interfaces 306A-H. Accordingly, interconnect controllogic 204 may invoke an instance of module manager 214 to logicallycouple a module received into any one of module interfaces 306A-H tomanagement controllers 210. This logical coupling may include thecontrol and/or management of the module once received and coupled to anyone of module interfaces 306A-H.

In an example embodiment, management controllers 210 may includemanagement controllers 304 and 305 shown in FIG. 3. Once module 302H isreceived and coupled to module interface 306H, module manager 214 maylogically couple module 302H to management controller 304 and/or 305.After module 302H is logically coupled, management controller 304 and/or305 may provide management and/or control functionality to module 302H.For example, module 302H may request to communicate with another modulecoupled to another interface resident on interconnect 110 (e.g., module302G). The management controller logically coupled to module 302H mayservice the request and facilitate the communications between module302H and the other module.

In an example embodiment, module interfaces 306A-H may also be referredto as “carrier bays” and modules 302A-H may also be referred to as“mezzanine cards.” A mezzanine card may provide additional functionalityto a carrier card when coupled to a carrier bay resident on the carriercard, although the invention is not limited in this regard. Thisadditional functionality may include, but is not limited to, providingmass storage, graphics processing, or I/O processors.

In an example embodiment, Interconnect 110 may operate in compliancewith both the ATCA specification and a proposed PIGMG specification.This proposed PIGMG specification provides guidelines for the design andoperation of carrier cards and mezzanine cards. The proposed PICMGspecification is known as the Advanced Mezzanine Card (AMC)Specification, PIGMG AMC.0 and is hereinafter referred to as “PICMGAMC.0.”

In this example embodiment, modules 302A-H may also operate and/or bedesigned to operate in compliance with PICMG AMC.0. In this regard, amanagement controller (not shown) may be resident on each module 302A-H.In the proposed PICMG AMC.0 specification, the logical coupling of eachmodule's management controller to a single management controllerresident on an interconnect is described. In an example implementation,module manager 214 may logically couple a module's management controllerto one of a plurality of management controllers resident on interconnect110 (e.g. management controllers 304 and 305). Accordingly, this mayenable the logical coupling of a PICMG AMC.0 compliant module to one ofa plurality of management controllers resident on an interconnect. Thislogical coupling may occur, for example, when a module is received andcoupled to a module interface resident on an interconnect, although theinvention is not limited in this regard.

FIG. 4 is an architectural diagram of an example module manager 214,according to one embodiment. Module manager 214 includes a couple engine410, control logic 420, memory 430, I/O interface 440, and optionallyone or more applications 450, each coupled as depicted.

In an example embodiment, couple engine 410 may include a detect feature412, and couple feature 414. Detect feature 412 detects when a module isreceived in a module interface resident on an interconnect. Couplefeature 414 then logically couples the received module to one of aplurality of management controllers responsive to and/or resident on theinterconnect.

Control logic 420 controls the overall operation of module manager 214and is intended to represent any of a wide variety of logic device(s)and/or executable content to implement the operation of module manager214. Control logic 420 may well comprise a microprocessor, networkprocessor, microcontroller, field programmable gate array (FPGA),application specific integrated circuit (ASIC), or executable content toimplement such control features, and/or any combination thereof. Inalternate embodiments, the features and functionality of control logic420 may well be implemented within couple engine 410.

In an example embodiment, control logic 420 invokes an instance ofcouple engine 410 to logically couple a module received in a moduleinterface resident on an interconnect to one of a plurality ofmanagement controllers responsive to the interconnect. As used herein,memory 430 is intended to represent a wide variety of memory mediaincluding, but not limited to volatile memory, non-volatile memory,flash and programmatic variables or states.

According to an example embodiment, memory 430 is used to temporarilystore a mapping table. This mapping table may be used to facilitate thelogical coupling of a module to a management controller responsive to aninterconnect.

I/O interfaces 440 provide a communication interface between modulemanager 214 and an electronic system. For example, module manager 214may be implemented as an element of a electronic system (e.g.,electronic system 200), wherein I/O interfaces 440 provide acommunication interface between module manager 214 and the electronicsystem via a communication channel (e.g., communication channel(s) 202).Control logic 420 can receive a series of instructions from applicationsoftware external to module manager 214 via I/O interfaces 440. Theseries of instructions may invoke control logic 420 to implement one ormore features of couple engine 410.

In an example embodiment, module manager 214 may include one or moreapplications 450 to provide instructions to control logic 420. Suchapplications 450 may well be invoked to generate a user interface, e.g.,a graphical user interface (GUI), to enable administration features, andthe like. In alternate embodiments, one or more features of coupleengine 410 may well be implemented as applications 450, invoked bycontrol logic 420 to invoke such features.

FIG. 5 illustrates an example block diagram architecture 500 for thelogical coupling of modules 302A-H to management controllers 304 and 305resident on interconnect 110, according to one embodiment. According tothis example embodiment, interconnect 110 is to be received and coupledto backplane 107 on modular platform 100. Interconnect 110 and modularplatform 100 may be compliant with the ATCA specification. Accordingly,modular platform 100 may manage/control boards or interconnects over asystem management bus known as the Intelligent Platform Management Busor “IPMB-0” (not shown). When interconnect 110 is received and coupledto backplane 107, a modular platform 100 system management functionknown as a “shelf manager” may detect this coupling and may enable powerand/or communication links to interconnect 110. Once coupled, shelfmanagers may continue to monitor and control interconnect 110 as well asother interconnects coupled to the backplane and responsive to theIPMB-0.

In an example embodiment, an ATCA compliant interconnect may alsocontain a management controller known as Intelligent Platform ManagementController or “IPMC.” An IPMC may manage the communications between theinterconnect and the shelf manager and then may relay any instructionsand/or information from the shelf manager (e.g., over an interconnectmanagement channel) to components (e.g., modules) coupled to theinterconnect.

In an example embodiment, interconnect 110 may operate in compliancewith the ATCA Specification as well as PICMG AMC.0. Additionally,interconnect 110 may include a plurality of management controllers. Inthis example embodiment, the plurality of management controllers mayinclude management controllers 304 and 305. Management controllers 304and 305 may each perform the functionality of an ATCA compliantinterconnect IPMC and also may be logically coupled to one or moremodules 302A-H. Thus, the shelf manager may communicate to the pluralityof management controllers on interconnect 110 over the IPMB-0 as if eachmanagement controller were representing a single ATCA compliantinterconnect. For example, when interconnect 110 couples to backplane107, management controllers 304 and 305 may each logically appear as amanagement controller for an ATCA compliant interconnect. Accordingly,interconnect 110 may logically appear to occupy the resources of twointerconnects while physically coupling to backplane 107 as oneinterconnect, although the invention is not limited in this regard.

In an example embodiment, interconnect 110 is received and coupled tobackplane 107 on modular platform 100. Once coupled to backplane 107,interconnect control logic 204 invokes an instance of module manager 214to logically couple management controllers 304 or 305 to modules alreadyreceived and coupled to module interfaces resident on interconnect 110.For example, couple engine 410 invokes an instance of detect feature 412to survey what modules are received and coupled to module interfaces306A-H. Detect feature 412 may then place the results of the survey intoa table temporarily stored in a memory (e.g., memory 430). After thesurvey is complete, couple engine 410 invokes an instance of couplefeature 414 to access the table stored by detect feature 412 and thenlogically couple each module to either management controller 304 or 305,although the invention is not limited in this regard.

In an example implementation, couple feature 414 may create a mappingtable to indicate what modules are logically coupled to what managementcontrollers. This mapping table may be temporally stored in a memory(e.g. memory 430). The mapping table, for example, may result in thelogical coupling depicted in block diagram architecture 500.

Once the mapping table is temporarily stored in a memory, detect feature412 may monitor module interfaces 306A-H to detect whether a module iseither uncoupled or a new module is received and coupled. If a module isremoved and/or another module is added, couple feature 412 may thenupdate the mapping table to reflect any possible changes to logicalcouplings to management controllers 304 or 305.

In an example embodiment, couple feature 414's determination of whatmodule to map to a specific management controller may be based on fixedor dynamic criteria. Fixed criteria, for example, may be based onassigning a given module interface to a given management controller.Thus, when detect feature 412 detects the receipt and coupling of amodule to that given module interface, the module is logically coupledto that management controller by couple feature 414. Dynamic criteria,for example, may be based on factors that may allow modules to belogically coupled to management controllers regardless of what givenmodule interface the module is received and coupled to. For example,modules may be logically coupled to balance the load between managementcontrollers. Thus, as modules are added or removed from an interfaceresident on an interconnect, couple feature 414 may dynamically adjustthe logical couplings to rebalance the load between the managementcontrollers.

In an example embodiment, the shelf manager on modular platform 100 maywant to power down at least a portion of the modules logically coupledto management controllers 304 and 305. Thus, the shelf manager sends apower down request over the IPMB-0 to the management controllers.Management controllers 304 and 305 may receive the command throughinterconnect I/O interfaces 208 and then power down modules logicallycoupled to each management controller to meet the shelf manager'srequest, although the invention is not limited in this regard.

FIG. 6 provides a view of an example modular platform 600 with 14 slotsto receive and couple interconnects to a backplane 607, according to oneembodiment. In an example embodiment, modular platform 600 is compliantwith the ATCA specification and includes slots 610A-N to receive andcouple interconnects to a backplane 607. Accordingly, slots 610A-N mayeach contain interfaces to receive I/O and power connectors located oneach interconnect to be coupled to modular platform 600.

In an example embodiment, FIG. 6 illustrates how an interconnect may bereceived and coupled to backplane 607 in a vertical manner. For example,interconnect 110 may be received and coupled into slot 610A in avertical manner. Thus, all the modules coupled to interconnect 110 maybe inserted into module interfaces 306A-H in a vertical manner as well.

FIG. 7 is an isometric view of an example interconnect 700 withinterfaces to receive and couple modules in a horizontal manner,according to one embodiment. In an example embodiment, interconnect 700includes similar elements to that of interconnect 110. However,interconnect 700 may include a number (e.g., ten (10)) of moduleinterfaces 706A-J that may receive and couple modules to interconnect700 in a horizontal manner.

In an example embodiment, to receive and couple in a horizontal manner,module interface 706A may receive and couple to module 702A so thatmodule 702A is perpendicular to circuit board 703. Accordingly, module702A is received and coupled in a horizontal manner, although theinvention is not limited in this regard.

FIG. 8 provides a view of an example modular platform 600 withinterconnect 700 received and coupled into slots 610L-N, according toone embodiment. In an example implementation, when interconnect 700 isreceived and coupled to slots 610L-N, module interfaces 706 L-N mayphysically appear to receive and couple a module to a backplane for amodular platform. For example, when module 702A is coupled to moduleinterface 706A, module 702A may physically appear to connect to aninterface resident on backplane 607 rather than to an interface residenton interconnect 700, although the invention is not limited in thisregard.

As shown in FIG. 8, boards or interconnects to be received and coupledto slots 610A-K are received in a vertical manner. In slots 610A-Cinterconnect 700 may also be inserted in a vertical manner. However,module interfaces 706A-J may appear to receive and couple modules to aninterface resident on backplane 607 in a horizontal manner, although theinvention is not limited in this regard.

FIG. 9 is a flow chart of an example method to couple a module to amanagement controller on an interconnect, according to one embodiment.In this example embodiment, interconnect 700 is received and coupled tobackplane 607 of modular platform 600 as depicted in FIG. 8.Accordingly, interconnect logic 204 may already have invoked an instanceof module manager 214 to monitor module interfaces 706A-J forindications of modules received or removed from these module interfacesresident on interconnect 700.

The process begins in block 910, where according to an exampleembodiment, module 702A is to be received and coupled to moduleinterface 706A of interconnect 700. In an example implementation, todetect when a module is received and coupled to a module interface,detect feature 412 may monitor module interfaces 706A-J. For example,detect feature 412 may monitor impedance on a pin, connector, or wirewithin or responsive to a module interface. Accordingly, when module702A is received and coupled to module interface 706A, detect feature412 may detect this receipt and coupling by changes in the impedance ona pin, connector or wire in module interface 706A, although theinvention is not limited in this regard.

In block 920, upon detect feature 412's detection of the receiving andcoupling of module 702A, couple engine 410 invokes an instance of couplefeature 414. Couple feature 414 may logically couple module 702A to oneof the management controllers resident on and/or responsive tointerconnect 700. For example, couple feature may logically couplemodule 702A to management controller 705 by populating one or moreentries in a mapping table. The mapping table is then temporary storedin a memory (e.g., memory 430). In an example implementation, once themapping table is populated it may then be used by either managementcontroller 704 or 705 to determine which module to manage and/or controlon interconnect 700.

Once module 702A's is logically coupled, the process may start over ifanother module is received and coupled in another module interfaceresident interconnect 700.

Reference is made again to the illustration of electronic system 200 inFIG. 2 where electronic system 200 represents the active circuitry on aninterconnect. In accordance with one embodiment, interconnect controllogic 204 controls the overall operation of electronic system 200 and isintended to represent any of a wide variety of logic device(s) and/orexecutable content to implement the operation of electronic system 200,described herein. In this regard, interconnect control logic 204 maywell comprise a microprocessor, network processor, microcontroller,FPGA, ASIC, executable content to implement such control features and/orany combination thereof.

In accordance with one example embodiment, machine-readable instructionscan be provided to interconnect memory 206 from a form ofmachine-accessible medium. As used herein, a machine-accessible mediumis intended to represent any mechanism that provides (i.e., storesand/or transmits) information in a form readable by a machine (e.g.,electronic system 200). For example, a machine-accessible medium maywell include: ROM; RAM; magnetic disk storage media; optical storagemedia; flash memory devices; electrical, optical, acoustical or otherform of propagated signals (e.g., carrier waves, infrared signals,digital signals); and the like. Instructions may also be provided tointerconnect memory 206 via a remote connection through interconnect I/Ointerfaces 208 (e.g., over a communication network).

Interconnect I/O interfaces 208 may enable one or more element(s), e.g.,interconnect control logic 204, to interact with input and/or outputdevices, for example, a mouse, keyboard, touchpad, cathode ray tubemonitor, liquid crystal display, etc.

Management controllers 210 may well comprise a microprocessor, networkprocessor, microcontroller, FPGA, ASIC, or executable content toimplement such control features, and/or any combination thereof. Inalternate embodiments, the features and functionality of managementcontrollers 210 may well be implemented within interconnect controllogic 204.

According to one example embodiment, module manager 214's logicalcoupling of a module to one of a plurality of management controllers maywell be implemented in hardware, software, firmware, or any combinationthereof. For example, module manager 214 may well be implemented as oneor more of an ASIC, special function controller or processor, FPGA,other hardware device, and firmware or software to perform at least thefunctions described herein.

In the previous descriptions, for the purpose of explanation, numerousspecific details were set forth in order to provide a thoroughunderstanding of the invention. It will be apparent, however, to oneskilled in the art, that the invention can be practiced without thesespecific details. In other instances, structures and devices were shownin block diagram form in order to avoid obscuring the invention.

References made in the specification to the term “responsive to” are notlimited to responsiveness to only a particular feature and/or structure.A feature may also be “responsive to” another feature and/or structureand also be located within or resident on that feature and/or structure.Additionally, the term “responsive to” may also be synonymous with otherterms such as “communicatively coupled to” or “operatively coupled to”,although the term is not limited in this regard.

References made in the specification to “one embodiment” or “anembodiment” means that a particular feature, structure or characteristicdescribed in connection with that embodiment is included in at least oneembodiment of the invention. Thus, the appearances of the phrase “in oneembodiment” appearing in various places throughout the specification arenot necessarily all referring to the same embodiment. Likewise, theappearances of the phrase “in another embodiment,” or “in an alternateembodiment” appearing in various places throughout the specification arenot all necessarily referring to the same embodiment.

While the invention has been described in terms of several embodiments,those of ordinary skill in the art will recognize that the invention isnot limited to the embodiments described, but can be practiced withmodification and alteration within the spirit and scope of the appendedclaims. The description is thus to be regarded as illustrative of,rather than limiting the scope and coverage of the claims appendedhereto.

1. A system, comprising: a telecommunications chassis, thetelecommunications chassis comprising: an array of multiple mezzaninecard interfaces to couple to carrier card interfaces of mezzanine cards,the mezzanine card interfaces accessible from the face of the chassis,the mezzanine card interfaces to provide defined carrier card signals tothe mezzanine cards when coupled, the mezzanine card interfaces arrangedin parallel along a first axis along the face of the chassis, whereineach of the mezzanine card interfaces is coextensive along a second axisalong the face of the chassis perpendicular to the first axis, whereineach of the at least ten mezzanine card interfaces is controlled andmanaged by a same carrier module; and the carrier module coupled to thearray of multiple mezzanine card interfaces, the carrier module tocontrol provision of power, provide an Intelligent Platform ManagementBus IPMB-0 signal, and control detection of coupling for each of the atleast ten mezzanine card interfaces.
 2. The system of claim 1, furthercomprising at least one Intelligent Platform Management Controller(IPMC) management controller to couple to inserted mezzanine cards. 3.The system of claim 2, wherein the at least one IPMC comprises multipleIPMCs; and further comprising logic to couple an inserted mezzanine cardto a one of the multiple IPMC controllers.
 4. The system of claim 1,further comprising respective mezzanine cards inserted into therespective mezzanine card interfaces, at least one of the insertedmezzanine cards comprising a mass storage mezzanine card.
 5. The systemof claim 1, wherein the mezzanine card interfaces physically appear toreceive and couple a module to a backplane for the modular platform. 6.The system of claim 1, wherein the mezzanine card interfaces compriseAdvanced Mezzanine Card (AMC) type interfaces.
 7. The system of claim 1,further comprising respective mezzanine cards inserted into therespective mezzanine card interfaces, at least one of the insertedmezzanine cards comprising a mezzanine card to provide graphicsprocessing functionality.